EN | PCBA Reverse Development

Overview服务概述

Working backwards, engineering forward

从成品反向解析，向前推进工程

PCB reverse engineering is the process of analyzing a finished printed circuit board to recreate the original design files — schematic, layout, BOM and Gerber files — without access to the manufacturer's documentation.

PCB 逆向工程是对成品电路板进行分析，以重建原始设计文件——原理图、布局、BOM 与 Gerber 文件，全程无需制造商文档。

In simple terms, you are working backwards. Forward engineering goes schematic → layout → fabrication. Reverse engineering goes fabrication → layout → schematic. The end result is a complete design package that lets you repair, replicate or improve the board.

简单来说，就是"反着做"。正向工程是原理图 → 布局 → 制造；逆向工程是制造 → 布局 → 原理图。最终成果是完整的设计资料包，可用于维修、复制或改进电路板。

✓ Multi-layer visual imaging and netlist extraction
✓ 多层板视觉成像与网络表提取
✓ Continuity checks & signal mapping
✓ 导通性检查与信号映射
✓ Component identification (part numbers & values)
✓ 元器件识别（型号与参数提取）
✓ CAD reconstruction in EDA software
✓ EDA 软件中的 CAD 重构

Capabilities抄板能力

Professional reverse engineering for every board type

覆盖各类板型的专业抄板技术

With professional PCB reverse engineering techniques and advanced tools, we can copy single-layer, double-layer and multi-layer printed circuit boards, including high-difficulty boards with blind and buried vias — restoring full design data for repair, replication or improvement.

依托专业的 PCB 抄板技术与先进的抄板工具，可抄制单层、双层、多层 PCB 电路板，并能对盲埋孔等高难度 PCB 电路板完成抄板工作，为维修、复制或改进恢复完整设计数据。

Single-Layer Boards单层板 Double-Layer Boards双层板 Multi-Layer Boards多层板 Blind & Buried Via Boards盲埋孔高难度板 HDI BoardsHDI 板 Flex / Rigid-Flex柔性 / 刚柔结合板

One-Stop PCB Services一站式 PCB 服务

Beyond reverse engineering — full PCB development chain

不止逆向工程——完整的 PCB 开发链

Building on our reverse engineering expertise, we cover the whole board development chain: recover locked chips, re-design or modify the layout, manufacture multi-layer boards in small batches, assemble them with SMT and validate with prototypes — all coordinated by one team.

依托逆向工程经验，我们覆盖电路板开发全链条：解锁受保护芯片、重新设计或改板、小批量制造多层板、SMT 贴装并完成样机验证——由同一团队一站式协调完成。

Chip & MCU Decryption

芯片解密服务

Deep research into MCU algorithms, architectures and processes to recover locked single-chip devices.

深入研究单片机算法、架构与工艺，解锁受保护的单片机设备。

Multi-Layer PCB Rapid Manufacturing

多层 PCB 快速制造

Small-batch, multi-lot production for high-, mid- and low-end and special products.

小批量多批次生产体系，满足高中低端及特殊产品需求。

SMT Assembly & Processing

SMT 加工

Placement, through-hole, post-soldering, testing and assembly with 10+ years of OEM/ODM experience.

贴片、插件、后焊、测试与组装，十余年 OEM/ODM 加工经验。

Prototype Making

样机制作

Multiple design proposals from your expectations, then build and iterate the prototype.

从客户期望出发提供多套设计方案，完成样机制作与迭代。

High-Speed PCB Design & Re-Layout

高速 PCB 设计/改板

High-speed, high-density and mixed-signal design — flex, rigid-flex, HDI and blind/buried via.

高速高密数模混合设计，支持柔性板、刚柔结合板、HDI、盲埋孔。

Four Disciplines四大技术环节

How we recreate your board

我们如何重建您的电路板

The work combines four disciplines, each contributing to a complete, accurate design package.

工作融合四个环节，共同构成完整、准确的设计资料包。

◉

Visual Analysis

视觉分析

High-resolution imaging of every layer captures traces, vias, pads and component placement in detail.

对每一层进行高分辨率成像，完整记录走线、过孔、焊盘与元件布局。

⌁

Electrical Analysis

电气分析

Continuity checks and signal mapping reconstruct the electrical connectivity and netlist of the board.

通过导通性检查与信号映射，重建电路板的电气连接关系与网络表。

⌗

Component Identification

元件识别

Part numbers and values are extracted from every component for an accurate BOM.

提取每个元器件的型号与参数，生成准确的 BOM 物料清单。

▦

CAD Reconstruction

CAD 重构

The schematic is rebuilt in EDA software, ready for review, modification and manufacturing.

在 EDA 软件中重建原理图，可直接用于审阅、修改与制造。

Our Process服务流程

From bare board to complete design files

从裸板到完整设计资料

PCB reverse engineering disassembles and analyzes the physical board to restore the full design package — schematic, PCB layout and BOM — widely used for replication, fault analysis and documentation completion.

PCB 逆向工程通过对已有实物电路板拆解分析，还原出原理图、PCB 版图、BOM 物料清单等全套设计资料，多用于仿制、故障分析与文档补全。

01

Physical Processing

物理处理 · 拆解

Prepare the bare board for analysis

将成品板还原为可分析的裸板

1
Desoldering拆焊
Every component is removed from the PCB safely, preserving parts for later identification.
安全拆除 PCB 上全部元器件，保留器件供后续识别。
2
Coating Removal涂层去除
Conformal coatings, potting compounds and other protective layers are cleared for clear inspection.
清除三防漆、灌封胶等保护层，露出清晰可检的板面。
3
Imaging Archive影像存档
High-resolution photos of both sides and key details are archived as the project baseline.
对电路板正反面及关键细节拍摄高清照片并归档，作为项目基线。

02

Structural Analysis

结构分析

Understand how the board is built, layer by layer

逐层还原电路板的制造结构

1
Layer Count Identification层数识别
The total number of copper layers in the stack-up is determined.
确定 PCB 叠层总数。
2
Cross-section Analysis切片分析
Physical cross-sectioning reveals the board’s internal layer structure.
通过切片观测电路板截面内部结构。
3
Inner Layer Imaging内层成像
X-ray and other imaging techniques capture the inner-layer routing.
使用 X 射线等手段获取内层走线图像。
4
Via Structure Analysis过孔结构分析
Via type, dimensions and plating structure are analyzed in detail.
解析过孔类型、尺寸与镀层结构。
5
Material Identification材料识别
Substrate material, copper foil thickness and other board parameters are confirmed.
确认基材、铜箔厚度等板材参数。

03

Electrical Reconstruction

电气重建

Rebuild the connectivity of every net

重建每一根网络的电气连接

1
Net Tracing网络追踪
Nets and connections are traced across every layer of the board.
追踪所有层的网络与连接关系。
2
Continuity Verification连通性验证
Instruments verify each connection to guarantee electrical accuracy.
用仪器测试核对连接，确保电气准确。
3
Functional Block Identification功能模块划分
Circuits are divided and mapped into recognizable functional units.
划分并识别各电路功能单元。
4
Schematic Reconstruction原理图重构
The schematic is rebuilt from the traced data, block by block.
基于追踪数据逐步还原电路原理图。
5
Design Rule Verification设计规则校验
Design rules and electrical consistency are validated before delivery.
校验设计规则与电气一致性，确保交付质量。

04

Documentation & Output

文档整理输出

Deliver a complete, manufacturable design package

输出可直接投产的完整设计资料

1
Component Value Identification元器件参数识别
All component values and markings are read and recorded.
读取并记录全部器件参数与丝印。
2
Package / Footprint Verification封装校验
Packages and footprints are verified against the actual pads.
核对元器件封装与焊盘一一对应。
3
BOM GenerationBOM 物料清单生成
A complete, procurement-ready BOM is delivered with the files.
输出完整 BOM 物料清单，可直接用于采购。

Deliverables交付成果

A complete design package

完整的设计资料包

⌗

Schematic

原理图

Rebuilt in EDA software, ready for review and re-engineering.

在 EDA 软件中重建，可直接审阅与再设计。

▦

PCB Layout

PCB 布局

Layer stack, traces, vias and pad geometry reproduced accurately.

精确还原层叠结构、走线、过孔与焊盘几何。

☰

BOM

BOM 物料清单

Component list with part numbers and values for procurement.

含型号与参数的元器件清单，便于采购。

◇

Gerber Files

Gerber 文件

Manufacturing-ready files for fabrication and assembly.

可直接用于制造与贴装的加工文件。

When to Use适用场景

Replicate · Analyze · Document

仿制 · 分析 · 补全

⇄

Replication

仿制

Legacy boards without documentation are reproduced from the rebuilt design files.

无文档的旧板卡，依据重建的设计文件进行复制生产。

✚

Fault Analysis

故障分析

Failures are traced down to netlist level for precise diagnosis and targeted repair.

对故障进行网络级定位诊断，实现精准维修。

☰

Document Completion

文档补全

Missing schematics, layouts and BOMs are restored for legacy equipment.

为老旧设备补全缺失的原理图、版图与物料清单。

PCBA Reverse Development

PCBA 逆向开发